Demonstration of a reliable high-performance and yielding Air gap interconnect process

Autor:	B. Krist, S. Suri, Sridhar Balakrishnan, Hui Jae Yoo, J. Bielefeld, Sean W. King, V. RamachandraRao, H. Hiramatsu, C. Ward, Kanwal Jit Singh, M. Harmes, Mauro J. Kobrinsky, P. Reese
Rok vydání:	2010
Předmět:	Interconnection Yield (engineering) Materials science Hardware_INTEGRATEDCIRCUITS Electronic engineering ComputerApplications_COMPUTERSINOTHERSYSTEMS Dielectric Air gap (plumbing) Capacitance Engineering physics
Zdroj:	2010 IEEE International Interconnect Technology Conference.
DOI:	10.1109/iitc.2010.5510708
Popis:	Capacitance coupling in copper low-k interconnects can be further reduced by implementing Air gaps in the intra-layer dielectric. This paper describes the evaluation of an integrated Air gap technology using 32 and 22 nm node technology vehicles. Electrical, reliability, and yield results are presented.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f6aa80711b00ee2dc16b91286d90f670 https://doi.org/10.1109/iitc.2010.5510708 Zobrazit plný text záznamu