Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
| Autor: | Richard Langlois, Christy S. Tyberg, Ray Robertazzi, Pascale Gagnon, Katsuyuki Sakuma, Christian Bergeron, Michael Scheurmann, Stephane Barbeau, Steve Whitehead, Matthew Wordeman |
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| Rok vydání: | 2017 |
| Předmět: |
Thermal copper pillar bump
Interconnection 030219 obstetrics & reproductive medicine business.product_category Materials science business.industry Stacking 02 engineering and technology Structural engineering 021001 nanoscience & nanotechnology Chip Compression (physics) 03 medical and health sciences Reflow soldering 0302 clinical medicine Logic gate Die (manufacturing) Composite material 0210 nano-technology business |
| Zdroj: | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). |
| Popis: | 3D multi-layer chip stacking is a significant assembly challenge with dependencies on die size and thickness, interconnect pitch, bump diameter, number of dies involved, and die warpage. The assembly processes used to overcome the technical difficulties associated with the stacking of medium and large logic dies with fine pitch copper pillar bumps is discussed, including mass reflow and thermo-compression bonding on 3 and 4 layers chip stacks. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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