Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films

Autor:	Peng Su, John P. Koppes, Wei-Hsun Chen, Carol A. Handwerker, Pylin Sarobol, John E. Blendell
Rok vydání:	2013
Předmět:	Materials science Misorientation Mechanical Engineering Whiskers Metallurgy Alloy Nucleation Recrystallization (metallurgy) Temperature cycling engineering.material Condensed Matter Physics Mechanics of Materials Whisker engineering General Materials Science Hillock
Zdroj:	Materials Letters. 99:76-80
ISSN:	0167-577X
DOI:	10.1016/j.matlet.2013.02.066
Popis:	Direct evidence was obtained for the nucleation of surface grains through recrystallization and their growth into whiskers and hillocks during thermal cycling of Sn-alloy films. Shallow grains with low dislocation densities nucleated at pre-existing film grain boundaries and grew at the expense of deformed parent grains. Micro-diffraction analysis showed that parent grains have a high grain orientation spread, subgrain formation, and high dislocation density. The whisker and hillock grains have different orientations from the parent grains. A crystallographic orientation relationship between a surface defect grain and one of the parent grains was demonstrated with the misorientation axis lying in the active slip planes of the parent grain.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f5f79904e5ff3b51350e1c53e8ae6f2a https://doi.org/10.1016/j.matlet.2013.02.066 Zobrazit plný text záznamu Full Text from ScienceDirect