Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering
| Autor: | Tianmin Luan, Jing-shan He, Weibing Guo, Jiuchun Yan, Xuesong Leng |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Metallurgy Metals and Alloys Nucleation Ultrasonic soldering chemistry.chemical_element 02 engineering and technology 021001 nanoscience & nanotechnology Geotechnical Engineering and Engineering Geology Condensed Matter Physics Microstructure 01 natural sciences Surface energy chemistry Aluminium Soldering 0103 physical sciences Materials Chemistry Ultrasonic sensor Composite material 0210 nano-technology Tin |
| Zdroj: | Transactions of Nonferrous Metals Society of China. 27:962-970 |
| ISSN: | 1003-6326 |
| Popis: | Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals. Pure Al was soldered with pure tin assisted by ultrasound. The influence of primary α(Al) on the microstructure of Al/Sn interface and its bonding strength was studied. It is found that the primary α(Al) in liquid tin tends to be octahedron enclosed by Al {111} facet with the lowest surface free energy and growth rate. The ultrasonic action could increase the nucleation rate and refine the particles of primary α(Al). For the longer ultrasonic and holding time, a large amount of the octahedral primary α(Al) particles crystallize at the Al/Sn interface. The bonding interface exhibits the profile of rough dentation, resulting in an increment of bonding interface area and the effect of mechanical occlusion. The bonding strength at interface could reach 63 MPa with ultrasonic time of 40 s and holding time of 10 min. |
| Databáze: | OpenAIRE |
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