Fluoride ions at the Cu-fluoropolymer interface
| Autor: | D. G. Abreu, Michael Mehan, A. Naujokas, Thomas P. Debies, Alan Entenberg, Gerald A. Takacs |
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| Rok vydání: | 2013 |
| Předmět: |
Argon
Materials science Analytical chemistry chemistry.chemical_element Surfaces and Interfaces General Chemistry Condensed Matter Physics Copper Surfaces Coatings and Films Ion chemistry.chemical_compound chemistry X-ray photoelectron spectroscopy Etching (microfabrication) Polymer chemistry Materials Chemistry Fluoropolymer Tetrafluoroethylene Fluoride |
| Zdroj: | Surface and Interface Analysis. 45:1056-1062 |
| ISSN: | 0142-2421 |
| DOI: | 10.1002/sia.5225 |
| Popis: | Nanometer thick films of sputtered and evaporated Cu were deposited on the surfaces of the fluoropolymers poly(tetrafluoroethylene) (PTFE), poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) and poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) and studied by both angle-resolved XPS at takeoff angles of 10°, 45° and 80° and in situ argon ion etching. Higher yields of the fluoride ion to fluoropolymer ratio were detected for sputtered than evaporated Cu. PFA and FEP show enhanced interaction with sputtered Cu to produce fluoride ions relative to the more polycrystalline PTFE. At intermediate depths (takeoff angle of 45°), PFA and FEP exhibit the strongest fluoride F 1s signals compared with the fluoropolymer peaks. The amount of fluoride ion detected reaches a maximum after brief Ar ion etching and then decreases with prolonged etching. Compared with untreated fluoropolymers, improved adhesion of evaporated Cu was observed on the fluoropolymer surfaces that were argon ion etched to expose fluoride ions. Copyright © 2013 John Wiley & Sons, Ltd. |
| Databáze: | OpenAIRE |
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