High Density Optical Packaging of High Radix Silicon Photonic Switches
| Autor: | Dan Neugroschl, Ming C. Wu, Johannes Henriksson, Jianheng Luo, Tae Joon Seok, Victor I. Kopp |
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| Rok vydání: | 2017 |
| Předmět: |
Materials science
Silicon photonics Hybrid silicon laser business.industry Photonic integrated circuit 02 engineering and technology Microstructured optical fiber 01 natural sciences 010309 optics 020210 optoelectronics & photonics Optics 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Optoelectronics Micro-Opto-Electro-Mechanical Systems business Plastic optical fiber Microphotonics Photonic crystal |
| Zdroj: | OFC |
| DOI: | 10.1364/ofc.2017.th5d.7 |
| Popis: | We report on high density optical packaging of high radix (64×64) silicon photonic MEMS switches using pitch-reducing optical fiber array. The footprint of 61-channel optical I/O is as small as 330μm × 280μm. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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