| Autor: |
W. Meinel |
| Rok vydání: |
2002 |
| Předmět: |
|
| Zdroj: |
IEEE International Symposium on Circuits and Systems. |
| DOI: |
10.1109/iscas.1990.112061 |
| Popis: |
A plastic-packaged analog isolation amplifier that utilizes a capacitive coupled path for encoded signals and is capable of operating at high voltage levels is described. The assembly uses standard techniques for building plastic packages, allowing high-volume assembly at low cost without sacrificing performance. There is a small interconnect circuit which is used to capacitively couple the signal from the input to the output. A pick-and-place machine is used to attach the interconnect substrate to the leadframe. A two-pass die attach is used to place die on the leadframe. A two-cavity wirebond clamp is used to hold down the leadframe during wirebonding. > |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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