| Popis: |
This paper presents a new low-cost, multi-layer interconnection architecture, which has the potential of being utilized in a space environment. Instead of conventional electrical input/output (I/O) pins, optical I/O pins are used to provide multi-layer interconnection. A small vertical cavity surface emitting laser diode array and photodetector array are used to transmit and receive signals, respectively. A specially fabricated end-face lensed fiber array is utilized to provide high-speed, low-loss, and low-crosstalk signal transmission. By employing this new optical I/O pin architecture, many types of standard multi-layer interconnection can be easily realized. This presentation covers the main concepts, major components, fabrication procedures, and expected applications of this architecture. |
