Autor:	Chris Kendrick, Yu-Hsing Cheng
Rok vydání:	2007
Předmět:	Engineering Pulse circuits business.industry Electronic engineering Fuse (electrical) Trimming Statistical analysis Integrated circuit packaging business Reliability engineering
Zdroj:	2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.
Popis:	Post package trimming is important in achieving precise control of circuit parameters that may shift due to package stresses. However, the size of on-chip driver circuitry must be minimized while still maintaining reliably trimmed fuses. This study presents a statistical analysis and physical characterization of trimmed fuses to optimize fuse geometry and trimming conditions.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f4ab8b50dbb6db6c72f002a7647a1aa7 https://doi.org/10.1109/relphy.2007.369978 Zobrazit plný text záznamu