In-situMeasurement of the Properties of Curing Systems with Microdielectrometry
| Autor: | Huan L. Lee, David R. Day, Norman F. Sheppard, Stephen D. Senturia |
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| Rok vydání: | 1982 |
| Předmět: |
Materials science
business.industry Transistor Relaxation (NMR) Analytical chemistry Surfaces and Interfaces General Chemistry Integrated circuit Dielectric Low frequency Isothermal process Surfaces Coatings and Films law.invention Planar Mechanics of Materials law Materials Chemistry Microelectronics Optoelectronics business |
| Zdroj: | The Journal of Adhesion. 15:69-90 |
| ISSN: | 1545-5823 0021-8464 |
| DOI: | 10.1080/00218468208073217 |
| Popis: | This paper addresses the in-situ measurement of various properties of curing systems with a particular dielectric method called Microdielectrometry. We have used integrated circuit technology to develop a miniaturized dielectric probe that combines small size with built-in amplification to achieve sensitivity at frequencies as low as 1 Hz. The device combines a planar interdigitated electrode structure with a pair of matched field-effect transistors. Calibration is based entirely on the details of the electrode geometry, and thus is stable with respect to temperature variations, and is reproducible from device to device. Generally, what is measured is the frequency dependent dielectric permittivity (ϵ) and dielectric loss factor (ϵ) in the frequency range 1–1000 Hz. In this paper, the results of isothermal cures of the amine-epoxy system DGEBA-MPDA are presented, and are shown to provide a measurement of a low-frequency dielectric relaxation time which can be correlated with bulk viscosity prior ... |
| Databáze: | OpenAIRE |
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