A leadless packaging concept for high frequency applications
| Autor: | W. Eurskens, Horst Theuss, W. Simburger, J. Hirtreiter, H. Knapp, Robert Weigel, Jochen Dangelmaier, M. Engl, Klaus Pressel, K. Gnannt |
|---|---|
| Rok vydání: | 2004 |
| Předmět: |
Engineering
Wire bonding business.industry Electrical engineering Electronic packaging Hardware_PERFORMANCEANDRELIABILITY Footprint (electronics) Chip-scale package Hardware_INTEGRATEDCIRCUITS Electronic engineering Quad Flat No-leads package Integrated circuit packaging business Monolithic microwave integrated circuit Flip chip |
| Zdroj: | 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). |
| Popis: | We present a low cost leadless packaging concept for applications in the GHz region. This package concept has an ultra-miniaturized footprint, small dimensions of the contact pads, and a standard package height of 0.4 mm. Further reduction of the package height is possible. The semiconductor chip can be implemented in a wire bond or a flip chip version. We demonstrate the capability of this package concept by three different applications in the GHz region. First, we show the performance of a filter component, designed to suppress the 3/sup rd/ harmonic in a GSM application. This example represents a wire bond version of the package concept. The other two demonstrators are high frequency bipolar transistors and frequency dividers working up to 30 GHz, respectively. They are based upon flip chip interconnects. The results show that the package concept using the flip chip version is not yet limited at frequencies of 30 GHz. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|