| Autor: |
Mitsuaki Kumazawa, Michio Komatsu, Tanemasa Asano, Kohei Nitta, Akihiro Ikeda, Toshiharu Hirai, Ryo Takigawa |
| Rok vydání: |
2015 |
| Předmět: |
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| Zdroj: |
3DIC |
| Popis: |
As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 µm and diameter of 10 µm within one minute. After annealing at 250 °C, the electric conductivity was 1.57 × 10−5 [Ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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