Evaluation on Process-induced Warpage of Novel Fan-Out Wafer Level Packaging using TSV Interposer-First Technology

Autor:	C. F. Yu, Y. W. Huang, T. Y. Ouyang, S. F. Cheng, C. C. Hsiao
Rok vydání:	2022
Zdroj:	2022 International Conference on Electronics Packaging (ICEP).
DOI:	10.23919/icep55381.2022.9795498
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f383f3c5ea9604d88f783a3da030e03a https://doi.org/10.23919/icep55381.2022.9795498 Zobrazit plný text záznamu