Reliability evaluation of tungsten donut-via as an element of the highly robust metallization
| Autor: | Verena Hein, Kirsten Weide-Zaage, Raj Sekar Sethu, Marco Erstling, Tianlin Bai |
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| Rok vydání: | 2016 |
| Předmět: |
Imagination
Chemical substance Computer science media_common.quotation_subject chemistry.chemical_element Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Tungsten 01 natural sciences Search engine Robustness (computer science) 0103 physical sciences Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Electronic engineering Electrical and Electronic Engineering Safety Risk Reliability and Quality media_common 010302 applied physics Interconnection business.industry 020208 electrical & electronic engineering Electrical engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry CMOS business Science technology and society |
| Zdroj: | Microelectronics Reliability. 64:259-265 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2016.07.136 |
| Popis: | The typical via layout in CMOS technology with AlCu-metallizations and tungsten via is cylindrical. Common vias have a size as small as possible in the related process. More challenging application, temperature and mission profiles require higher robustness of a metallization [1,2]. Via arrays of small common vias are in use to the transfer of higher currents [3]. But the typical via array layout is not the best layout for applications which are faced to high mechanical stress because via arrays metal layer connections make these parts in the stack inflexible. The developed so called highly robust metallization is optimized for applications with extended operating conditions regarding higher currents and temperatures as well as mechanical stress [4]. Donut-Vias are elements of the highly robust metallization for the interconnection of highly robust metal lines. The paper shows the layout of a Donut-Via and explains the benefits and limits of the new layout by simulation and test results. |
| Databáze: | OpenAIRE |
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