Theoretical analysis on extrusion die flow of electronic packaging materials

Autor:	Ping-Yao Wu, Ta-Jo Liu, Jing-Pin Pan
Rok vydání:	1999
Předmět:	Extrusion moulding Engineering drawing Environmental Engineering Materials science Bar (music) General Chemical Engineering Electronic packaging Mechanical engineering Die (integrated circuit) Taguchi methods Flow (mathematics) Heat transfer Extrusion Biotechnology
Zdroj:	AIChE Journal. 45:424-431
ISSN:	1547-5905 0001-1541
DOI:	10.1002/aic.690450221
Popis:	A mathematical model has been developed to describe the extrusion die flow of reactive electronic packaging materials. This model assumes that the flow is 1-D in the manifold of the die, but the flow obeys the 2-D Hele–Shaw model in the slot section. A realistic viscosity expression that includes the effects of chemical reaction and heat transfer has been adopted. A linearly tapered coat-hanger die was selected for illustration and the packaging material was chosen to be the epoxy system. Some example calculations are presented to illustrate the effects of several parameters on the flow distribution. Two optimization approaches were adopted to improve the uniformity of the flow; both the Taguchi method and the method of inserting a specially designed choker bar are applicable. However, using a choker bar appears to be more effective and flexible.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f31b35ef507aa28a8a2b740d39377256 https://doi.org/10.1002/aic.690450221 Zobrazit plný text záznamu Plný text