32nm Node Highly Reliable Cu/Low-k Integration Technology with CuMn Alloy Seed

Autor:	Oluwafemi O. Ogunsola, Fen Chen, Andrew H. Simon, Shaoning Yao, Stephan Grunow, Tom C. Lee, Baozhen Li, Paul S. McLaughlin, Matthew Angyal, Vincent J. McGahay, Cathryn Christiansen
Rok vydání:	2011
Předmět:	Materials science Stress migration Metallurgy Alloy engineering Interconnect technology Node (circuits) engineering.material Electromigration Shut down
Zdroj:	MRS Proceedings. 1335
ISSN:	1946-4274 0272-9172
Popis:	This paper introduces a highly reliable Cu interconnect technology at the 32 nm node with CuMn alloy seed. A CuMn alloy liner seed process combined with a non-gouging liner has been integrated into the minimum-pitch wiring level. Stress migration fails with CuMn seed at plate-below-via structures were shut down by a non-gouging liner process. Integration with gouging liner and non-gouging liner is compared, and results of interaction with CuMn seed are discussed in this paper.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f2f1ae5aedfda0e9da1312fcfc0b12ff https://doi.org/10.1557/opl.2011.1261 Zobrazit plný text záznamu Full text from SpringerLink