Liquid Compression Mold Underfill Designed for One-Step Encapsulation in Overmold Process

Autor:	Yuto Shigeno, Yukihiro Ikeda, Kyota Aoyama, Tsuyoshi Kamimura
Rok vydání:	2023
Zdroj:	2023 International Conference on Electronics Packaging (ICEP).
DOI:	10.23919/icep58572.2023.10129717
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f26f320a057b5de0a37d4c7adf9d98bc https://doi.org/10.23919/icep58572.2023.10129717 Zobrazit plný text záznamu