Overlay budget analysis for the 100 nm device generation
| Autor: | K. Simon, Franco Cerrina, Olga Vladimirsky, Yuli Vladimirsky |
|---|---|
| Rok vydání: | 1999 |
| Předmět: |
Fabrication
Optical alignment Computer science Nanotechnology Overlay engineering.material Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Coating Resist Electronic engineering engineering Wafer Electrical and Electronic Engineering |
| Zdroj: | Microelectronic Engineering. 46:457-460 |
| ISSN: | 0167-9317 |
| Popis: | In order to improve overlay capabilities for future exposure tools, it is necessary to understand the contributions from various sources. The most important contributions come from well-known sources like mask pattern placement accuracy, alignment system accuracy and from exposure tool stage performance. As the allowances for overlay budget decrease, and improvements in mask fabrication and stage performance are made, a number of previously less significant contributions need to be considered. These contributions include resolution, optical interference, focusing accuracy of the alignment system, and wafer processing deviations. These contributions are characterized in detail in this paper. The investigation was focused on a proven optical alignment system (ALX^T^M) contributions from wafer processing (resist coating and metallization). |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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