Multichip-on-flex plastic encapsulated MHDI-low cost substrateless manufacturing for microwave and millimeterwave modules

Autor:	R.J. Street, P.D. Cooper, P.A. Piacente
Rok vydání:	2002
Předmět:	Interconnection Materials science business.industry Electrical engineering visual_art Hardware_INTEGRATEDCIRCUITS visual_art.visual_art_medium FLEX Ceramic Integrated circuit packaging Transceiver business Monolithic microwave integrated circuit Microwave Polyimide
Zdroj:	1996 IEEE MTT-S International Microwave Symposium Digest.
DOI:	10.1109/mwsym.1996.508497
Popis:	This paper describes Chip-on-Flex (COF) technology developed by Lockheed Martin/GE as a low cost derivative of the LM/GE Microwave High Density Interconnect (MHDI) technology. Cost take-out is being achieved by directly mounting MMIC chips onto a pre-fabricated polyimide flex circuit eliminating the need to procure expensive ceramic or metal substrates. Structural rigidity is provided by molded plastic to encapsulate the back of the chips. A C-Band T/R module is reported as the proof-of-concept demonstration vehicle, with up to 3.5 watts RF output having been measured over 5 to 6 GHz.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f19ea8a54e6a574eb0661a1e50b85e4a https://doi.org/10.1109/mwsym.1996.508497 Zobrazit plný text záznamu