Investigation of the oxidation behaviour of thin film and bulk copper
| Autor: | Gabriel M. Crean, C. NíDheasuna, S. Lynch, X. Jiang, M. O'Reilly, J. C. Patterson, J. T. Beechinor |
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| Rok vydání: | 1995 |
| Předmět: |
Range (particle radiation)
Materials science Analytical chemistry Oxide General Physics and Astronomy chemistry.chemical_element Surfaces and Interfaces General Chemistry Rate equation Activation energy Atmospheric temperature range Condensed Matter Physics Copper Surfaces Coatings and Films Thermogravimetry chemistry.chemical_compound chemistry Thin film |
| Zdroj: | Applied Surface Science. 91:152-156 |
| ISSN: | 0169-4332 |
| DOI: | 10.1016/0169-4332(95)00111-5 |
| Popis: | Thermogravimetry (TGA) and spectroscopic ellipsometry (SE) were employed to examine the oxidation behaviour of Cu. Thermogravimetry was used to study the oxidation behaviour of bulk Cu (99.9% purity) in the range 250 to 500°C. Within this temperature range the predominant oxidation product was cupric oxide (CuO) and the reaction followed a cubic rate law. The activation energy was calculated to be 71 kJ/mol. At lower temperatures ( |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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