A Model of CMP about Magnetic Fluid and its Numerical Simulations

Autor:	Yong Zhou Li, Qiu Yun Zheng, Xiao Ping Fan
Rok vydání:	2011
Předmět:	Centrifugal force Ferrofluid Materials science business.industry Chemical-mechanical planarization Slurry Wafer General Medicine Mechanics Structural engineering business Resultant force
Zdroj:	Applied Mechanics and Materials. :333-338
ISSN:	1662-7482
DOI:	10.4028/www.scientific.net/amm.101-102.333
Popis:	Chemical mechanical polishing (CMP) is one of the most effective technologies in modern ultra-precision processing. In this paper, we consider the slurry is ferromagnetic fluid and the influence of the centrifugal force, and then obtain the equations about this slurry in CMP. The slurry pressure distribution, resultant forces and moments acting on the wafer are calculated in typical conditions, and the affects of film thickness, roll and pitch angles are also calculated.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f0f615f0437a0a7f9418f6fbb6abae28 https://doi.org/10.4028/www.scientific.net/amm.101-102.333 Zobrazit plný text záznamu