Proposal of The New Compact Thermal Model Based on One-Dimensional Thermal Network for Microprocessor Packages

Autor:	Shinji Nakagawa, Koji Nishi, Tomoyuki Hatakeyama, Masaru Ishizuka
Rok vydání:	2019
Předmět:	Microprocessor Thermal network law Computer science Electronic engineering Electrical and Electronic Engineering Thermal model law.invention
Zdroj:	Journal of The Japan Institute of Electronics Packaging. 22:291-300
ISSN:	1884-121X 1343-9677
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::f0a08bb2a4102c01f2b76373a16c8778 https://doi.org/10.5104/jiep.22.291 Zobrazit plný text záznamu