Heat-resistant epoxy-silicon hybrid materials for printed wiring boards
| Autor: | Yuichi Satsu, Akio Takahashi, Morimichi Umino, Akira Nagai, Yoshihiro Nakamura |
|---|---|
| Rok vydání: | 2005 |
| Předmět: |
chemistry.chemical_classification
Materials science Fabrication Silicon chemistry.chemical_element Polymer Epoxy Industrial and Manufacturing Engineering Composite epoxy material chemistry visual_art visual_art.visual_art_medium Electrical and Electronic Engineering Composite material Hybrid material Glass transition Elastic modulus |
| Zdroj: | IEEE Transactions on Electronics Packaging Manufacturing. 28:163-167 |
| ISSN: | 1521-334X |
| DOI: | 10.1109/tepm.2005.846831 |
| Popis: | An epoxy-silicon hybrid resin based on a new concept has been developed. This resin has a structure in which epoxy-silicon oligomers by sol-gel reaction are incorporated into the epoxy resin matrix at the nanometer level. The nanostructure was confirmed by /sup 29/Si NMR spectrum and a time-resolved energy filtering-transmission electron microscopy technique. This epoxy-silicon hybrid resin shows excellent mechanical properties at high temperatures. The elastic modulus at 260/spl deg/C was 0.6 GPa, much higher than the 0.08 GPa of conventional epoxy resins; and the thermal expansion coefficient above the glass transition temperature was two-thirds of the conventional one. It was confirmed that conventional fabrication process for FR-5 was applicable to copper clad laminates for the epoxy-silicon hybrid resin. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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