Application of Nonlinear Fracture Mechanics Parameter to Predicting Wire-Liftoff Lifetime of Power Module at Elevated Temperatures
| Autor: | Yutaka Hayama, Noriyuki Miyazaki, Wataru Morooka, Nobuyuki Shishido, Seiya Hagihara |
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| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Physics Wire bonding 020208 electrical & electronic engineering Energy Engineering and Power Technology 02 engineering and technology Mechanics 01 natural sciences Thermal expansion Finite element method Stress (mechanics) Creep Power module 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Junction temperature Electric power Electrical and Electronic Engineering |
| Zdroj: | IEEE Journal of Emerging and Selected Topics in Power Electronics. 7:1604-1614 |
| ISSN: | 2168-6785 2168-6777 |
| DOI: | 10.1109/jestpe.2019.2914244 |
| Popis: | Power modules are utilized for electric power control and play a key role in efficient energy conversion. A structural reliability problem of wire bonding, wire-liftoff, in power modules becomes important at high-temperature operation. Wire-liftoff is a thermal fatigue phenomenon caused by thermal stress due to mismatch of coefficients of thermal expansion between a wire and a chip material. According to experimental studies, a saturation phenomenon of wire-liftoff lifetime was observed in power modules above the maximum junction temperature of 200 °C. In this paper, we examine the failure models for predicting wire-liftoff lifetime proposed in the previous studies and also propose a new failure model based on the nonlinear fracture mechanics parameter $T^\ast $ -integral range $\Delta T^\ast $ . Among various failure models, the proposed model is the best to represent a saturation phenomenon of wire-liftoff lifetime. For practical use of the failure model based on $\Delta T^\ast $ -integral range, we propose a simple calculation method of $\Delta T^\ast $ -integral range that can be calculated by using the commercial finite element computer code such as Marc, Ansys, and so on. |
| Databáze: | OpenAIRE |
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