Power Module Wire Bond Design for Reliability

Autor:	Jiun-Hsiang Chen, Wei-Hao Chi, Hao-Chih Chen, Hsueh-Kuo Liao
Rok vydání:	2021
Zdroj:	2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
DOI:	10.1109/impact53160.2021.9696969
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ef73a917d25730479e9da6ea6a6188c1 https://doi.org/10.1109/impact53160.2021.9696969 Zobrazit plný text záznamu