Corrigendum to 'Effect of intermetallic compounds on mechanical properties of copper joints ultrasonic-soldered with Sn-Zn alloy' [J. Mater. Process. Technol. 248 (2017) 123–129]
Autor: | Jingshan He, Shenghua Yang, Zhipeng Ma, Jiuchun Yan, Tianmin Luan, Weibing Guo |
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Rok vydání: | 2018 |
Předmět: | |
Zdroj: | Journal of Materials Processing Technology. 251:93-94 |
ISSN: | 0924-0136 |
Databáze: | OpenAIRE |
Externí odkaz: |