Failure analysis of solder joints with a damage-coupled viscoplastic model

Autor:	Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen
Rok vydání:	2003
Předmět:	Numerical Analysis Materials science Viscoplasticity business.industry Applied Mathematics Subroutine Constitutive equation General Engineering Structural engineering Plasticity Finite element method Creep Soldering Elasticity (economics) business
Zdroj:	International Journal for Numerical Methods in Engineering. 56:2199-2211
ISSN:	1097-0207 0029-5981
Popis:	This paper presents failure analysis of solder joints with a damage-coupled viscoplastic model. A material model is developed to characterize the elasticity, plasticity, creep and damage of solder. A semi-implicit time-integration approach is adopted for the numerical implementation of the solder model. This solder model has been implemented into finite element codes developed at Sandia National Laboratories and into the commercial, finite element code ABAQUSTM with its user-defined material subroutine UMAT. Finite element analyses are performed on solder joints with the new solder constitutive model and mesh dependency of these analyses is investigated. Copyright © 2003 John Wiley & Sons, Ltd.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ef22268fba95b94d8f4d5d97bd3d6344 https://doi.org/10.1002/nme.660 Zobrazit plný text záznamu Plný text