An Embedded GaN Power Module with Double-Sided Cooling and High-Density Integration

Autor:	Xingyue Tian, Niu Jia, Dennis Boris Chertkovsky, Jingjing Sun, Hua Bai, Leon M. Tolbert, Han Cui
Rok vydání:	2022
Zdroj:	2022 IEEE Energy Conversion Congress and Exposition (ECCE).
DOI:	10.1109/ecce50734.2022.9947786
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ef11fc2d88eb65940876a92c36e09818 https://doi.org/10.1109/ecce50734.2022.9947786 Zobrazit plný text záznamu