Hard encapsulation of automotive power modules by epoxy potting – encapsulant selection assisted by thermo-mechanical simulation
| Autor: | M Sprenger, F Forndran, B Ottinger, T Dammann, B Erben, M Sippel, J Franke |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). |
| DOI: | 10.1109/eurosime54907.2022.9758880 |
| Databáze: | OpenAIRE |
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