Reliability of Fine-Pitch <5-μm-Diameter Microvias for High-Density Interconnects
| Autor: | Pulugurtha Markondeya Raj, Rao Tummala, Madhavan Swaminathan, Takenori Kakutani, Daichi Okamoto, Shreya Dwarakanath |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Microvia Interconnection Materials science High density Fine pitch Geometry Dielectric 01 natural sciences Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials 010104 statistics & probability Reliability (semiconductor) 0103 physical sciences 0101 mathematics Electrical and Electronic Engineering Material properties |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1552-1559 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2020.3013197 |
| Popis: | Downscaling of package wiring has been the singular focus to achieve higher logic-memory interconnect density to meet next-generation needs for high-bandwidth computing. This article presents, for the first time, a systematic modeling and experimental study of sub-5- $\mu \text{m}$ -diameter microvia reliability. Geometry design considerations and build-up dielectric material properties in evaluating the microvia fatigue life are investigated. Finally, experimental thermal-cycling reliability results of sub-5- $\mu \text{m}$ -diameter microvias are correlated with the modeling results. |
| Databáze: | OpenAIRE |
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