Influence of SU8 Photopolymer for Silicon RFMEMS Packaging Applications

Autor:	Sayanu Pamidighantam, Oddvar Søråsen, Srinivasa Reddy Kuppireddi
Rok vydání:	2013
Předmět:	Microelectromechanical systems Materials science Silicon business.industry chemistry.chemical_element Epoxy Electric power transmission Photopolymer chemistry visual_art visual_art.visual_art_medium Optoelectronics Radio frequency business Wafer-level packaging Microwave
Zdroj:	International Journal of Materials Science and Engineering. 1:79-81
ISSN:	2315-4527
DOI:	10.12720/ijmse.1.2.79-81
Popis:	Epoxy based photopolymer–SU8 is evaluated as microwave packaging material for packaging of Radio Frequency Micro Electro Mechanical Systems (RFMEMS). Standard and Slotted Coplanar Wave guide (CPW) transmission lines are chosen as test vehicles. Transmission lines of lengths up to 10mm are formed on HRS substrates. The fabricated transmission lines are subjected to wafer level packaging. The measured S-parameter data shows a significant difference prior to and after packaging. Further, the effects due to the packaging could be model educing lumped components and the measured data are presented in this work.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::edc2fb581989b028d1710cf1939965a2 https://doi.org/10.12720/ijmse.1.2.79-81 Zobrazit plný text záznamu