Novel method for NCF flow simulation in HBM thermal compression bonding process to optimize the NCF shape
| Autor: | Jong Pa Hong, Su Chang Lee, Sun Woo Han, Sang Kun Oh, Sang Sik Park, Hyeong Mun Kang, Won Keun Kim, Kil Soo Kim, Dan Oh |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). |
| Databáze: | OpenAIRE |
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