| Autor: |
Xiaowu Zhang, Shiguo Liu, Kalyan Biswas, Tai Chong Chai |
| Rok vydání: |
2007 |
| Předmět: |
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| Zdroj: |
2007 9th Electronics Packaging Technology Conference. |
| Popis: |
This work focuses on co-design of the 1st level and 2nd level solder joint reliability analysis of a flip chip package, with large die. Model with all the layered structures for the build up substrate is compared with the compact model of equivalent substrate. Two 1st level solder bumps are modeled along with the 2nd level solder balls. The fatigue life of 2nd level solder joint is estimated by the Darveaux's method. Inelastic strain energy density per cycle accumulated in the solder bumps during thermal cycling is used to predict the trend of fatigue life for the 1st level bumps. Model with and without heat spreader are considered in this study. Then a series of parametric study is performed by varying different crucial package dimensions which play an important role in solder fatigue life. Effects of die thickness, substrate thickness and heat spreader type on solder fatigue life are analyzed in this paper. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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