Applying the selective Cu electroplating technique to light-emitting diodes

Autor:	Lo-Lin Chen, Shih-Chieh Hsu, Dar-Jong Lin, Cheng-Lan Lin
Rok vydání:	2014
Předmět:	Materials science business.industry Metallurgy chemistry.chemical_element General Chemistry Substrate (electronics) Copper law.invention chemistry law Optoelectronics business Electroplating Current density Diode Light-emitting diode
Zdroj:	Research on Chemical Intermediates. 40:2347-2354
ISSN:	1568-5675 0922-6168
DOI:	10.1007/s11164-014-1611-z
Popis:	We successfully fabricated a predefined patterned copper (Cu) substrate for thin GaN light-emitting diodes without barriers by the selective electroplating technique. The contours of Cu bumps fabricated using different electroplating modes and parameters were measured. We observed that the average thickness diminished with increasing current density. The current density conditions to obtain the best upright structure in the process were 40 and 80 mA/cm2.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ed2ded96f2389693762a2cc0c407bae3 https://doi.org/10.1007/s11164-014-1611-z Zobrazit plný text záznamu Plný text ve formátu PDF