| Autor: |
Akinori Yui, Nagahisa Ogasawara, Hirotsugu Saito, Jumpei Kusuyama, Takayuki Kitajima, Shintaro Iwahashi, Alexander H. Slocum |
| Rok vydání: |
2016 |
| Předmět: |
|
| Zdroj: |
Advanced Materials Research. 1136:655-660 |
| ISSN: |
1662-8985 |
| DOI: |
10.4028/www.scientific.net/amr.1136.655 |
| Popis: |
Increasing the wafer diameter from φ300 mm to φ450 mm is required to enhance semiconductor devices productivity. A high-stiffness rotary grinding machine equipped with water hydrostatic bearings was developed for a φ450 mm silicon wafer. The grinding machine has an upper structure consisting of a wheel spindle system and a lower structure consisting of a rotary worktable system. The spindle shaft creates both rotary and axial feeding motion. The upper and lower structures are clamped together rigidly by three kinematic couplings. A higher loop stiffness is required for the grinding machine because grinding the larger wafer requires a higher grinding force. This paper investigates the loop stiffness of the developed wafer grinding machine. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
