| Popis: |
Currently, there are two major trends in embedding technology: embedding for system in package and system in board (SiB). This chapter discusses the basic construction, manufacturing process, design features, manufacturing format, package performance, robustness, and applications of integrated interposer. The major difference between i 2 Board and other embedding technologies is that i 2 Board is a fan‐out packaging technology. Since the i 2 Board is an SiB technology, the material of choice is derived from the target specification of the finished application. For a robust process, 80 μm bond pad pitch is reasonable but depends on the interconnection technology of choice. The i 2 Board passed and exceeded the qualification tests of leading automotive suppliers. An internal qualification regarding the reliability of interconnections has been completed with outstanding results. There is demand for embedding in telecommunication as well as from automotive customers. |
