Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys
| Autor: | Yu Tang, Guo Qiwei, Guibo Li, Zhao Li |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Materials science
Scanning electron microscope Mechanical Engineering Constitutive equation Metals and Alloys 02 engineering and technology Strain rate 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences 0104 chemical sciences Shear (geology) Mechanics of Materials Soldering Materials Chemistry Shear stress Ceo2 nanoparticles Composite material 0210 nano-technology Spectroscopy |
| Zdroj: | Journal of Alloys and Compounds. 789:150-162 |
| ISSN: | 0925-8388 |
| Popis: | In this article, the shear properties of Sn–0.3Ag–0.7Cu-xCeO2 composite solder alloys were investigated at strain rates of 10−3s−1, 10−2s−1, and 10−1s−1 under three different temperatures of 25 °C, 75 °C, and 125 °C. Scanning electron microscope equipped with Energy-dispersive X-ray spectroscopy was used to observe the microstructural evolution and the fracture surface of the composite solder alloys. The results show that appropriate addition of CeO2 nanoparticles can improve the shear stress of the composite solder alloys. However, the excessive addition of CeO2 nanoparticles could degrade the mechanical properties. With an increase in strain rate or a decrease in test temperature, the shear stress of all solder alloys shows an increasing trend. A modified constitutive model was used to describe the effect of strain rate and temperature on shear stress. The optimum addition concentration of CeO2 nanoparticles in Sn–0.3Ag–0.7Cu-xCeO2 solder alloys is about 0.5 wt%, which possesses the highest shear stress. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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