Non-Hermetic Micropackage for Chronic Implantable Systems

Autor: Wen H. Ko, Shem Benjamin Lachhman, Christian A. Zorman, Di Sun, Steve Majerus, Margot S. Damaser, Philip X.-L. Feng, Peng Wang
Rok vydání: 2013
Předmět:
Zdroj: International Symposium on Microelectronics. 2013:000166-000170
ISSN: 2380-4505
DOI: 10.4071/isom-2013-ta55
Popis: We report on the development of a non-hermetic micropackage technology that employs multiple layers of polydimethylsiloxane (PDMS), epoxy, and parylene-C thin films for conformal coating of chronic biomedical implantable systems with laboratory testing results in saline bath at 85°C, achieving very long micropackaging lifetime (up to ~2–5 years). By combining experiments of material characterization and qualitative analysis of the observations, we explain the measured long lifetimes of the micropackages (projected equivalent of ~2–5 years) using these non-hermetic coating materials and composites.
Databáze: OpenAIRE