A fractal dimension feature extraction technique for detecting flaws in silicon wafers
| Autor: | G.T. Stubbendieck, W.J.B. Oldham |
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| Rok vydání: | 2003 |
| Předmět: |
Physics::Instrumentation and Detectors
Computer science business.industry Feature extraction ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Process (computing) ComputerApplications_COMPUTERSINOTHERSYSTEMS Hardware_PERFORMANCEANDRELIABILITY Image segmentation Fractal dimension Fault detection and isolation Computer Science::Other Fractal Computer Science::Computer Vision and Pattern Recognition Hardware_INTEGRATEDCIRCUITS Wafer Computer vision Artificial intelligence business Feature detection (computer vision) |
| Zdroj: | [Proceedings 1992] IJCNN International Joint Conference on Neural Networks. |
| Popis: | The authors present a feature extraction method for detecting flaws in silicon wafers based on the idea of fractal dimension. They begin by discussing why fractal dimension is a good way to model wafer surface images. They then describe how to calculate the fractal dimension of a computer image of a wafer and how the results of such a calculation can be used for fault detection and image segmentation. The results of the application of this process to some wafer images are included. > |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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