Effects of Thermo-Mechanical Fatigue and Low Cycle Fatigue Interaction on Performance of Solder Joints
| Autor: | Aygul Z. Ibatova, Vahid Samavatian, K. H. Kishore, M. Kavitha, Aravindhan Surendar |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Drop (liquid) Fractography 02 engineering and technology Temperature cycling Strain rate 021001 nanoscience & nanotechnology 01 natural sciences Finite element method Electronic Optical and Magnetic Materials Creep Soldering 0103 physical sciences Electrical and Electronic Engineering Composite material 0210 nano-technology Safety Risk Reliability and Quality Thermo-mechanical fatigue |
| Zdroj: | IEEE Transactions on Device and Materials Reliability. 18:606-612 |
| ISSN: | 1558-2574 1530-4388 |
| DOI: | 10.1109/tdmr.2018.2879123 |
| Popis: | This paper demonstrates the feasibility of low cycle fatigue effects on the thermo-mechanical fatigue evolution in the solder joints of a power module. To achieve this goal, finite-element method (FEM) simulation and experimental studies have been carried out. One of the prepared samples was exposed to the sole thermal cycling while another one underwent frequent drop impacts, as an indicator of low cycle fatigue event, during the thermal cycling. The FEM results indicate that the thermal cycling leads to the accumulated creep strain in the solder joints. The amount of creep strain considerably increases when the drop impacts are coupled to the thermal cycling. This phenomenon is due to the additional peeling stress applied by drop impacts to the solder joints. It is also revealed that with an increase in the number of drop impacts, the rate of strain accumulation declines which may be due to the restriction of changes led by stress triaxiality. The fractography also validates that the sample exposed to both drop and thermal loadings shows an entire brittle fracture mode. Moreover, the EDS map shows that the elemental distribution heterogeneity and intermetallic growth were created under mutual effects of drop impacts and thermal cycle fatigue. |
| Databáze: | OpenAIRE |
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