Effect of anisotropic mechanical properties of woven composite substrates on warpage orientation of printed circuit boards
| Autor: | Cheolgyu Kim, Jae-Bum Pyo, Min Sung Kim, Taek-Soo Kim, Tae-Ik Lee |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Materials science
Fabrication Yield (engineering) Composite number 02 engineering and technology Substrate (printing) Epoxy 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Thermal expansion 0104 chemical sciences Composite epoxy material Residual stress visual_art visual_art.visual_art_medium Composite material 0210 nano-technology |
| Zdroj: | 2017 International Conference on Electronics Packaging (ICEP). |
| DOI: | 10.23919/icep.2017.7939449 |
| Popis: | In this study, a mechanism of warpage orientation determination is investigated for thin package substrates. Understanding the mechanism is important because assembly process yield will significantly increase if the warpage orientation is controllable. We found that the copper clad laminate (CCL) itself already contains considerable residual stress from its thermo-compression fabrication, due to low coefficient of thermal expansion (CTE) of the woven glass/epoxy core substrate. It was interesting that most of the specimens bent in bias direction of the glass fabric. Concentrating on thermo-mechanical properties of the composite substrate, it was verified that the warpage orientation is sensitively determined by both anisotropic moduli and CTEs of the thin and compliant core substrate. |
| Databáze: | OpenAIRE |
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