Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx)
| Autor: | Dai Ishikawa, Hideo Nakako, Thomas Blank, Helge Wurst, Felix Steiner |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 International Conference on Electronics Packaging (ICEP). |
| Databáze: | OpenAIRE |
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