Mechanical Shock Durability Studies of Sn-Ag-Cu-Ni BGA Solder Joints on Electroless Ni-P/Au Surface Finish

Autor:	Masato Ujiie, Hiroshi Okada, Hajime Yanase, Fumiyoshi Kawashiro, Takaki Etou
Rok vydání:	2009
Předmět:	Reflow soldering Materials science Ball grid array Soldering Metallurgy Wetting Surface finish Solder ball Composite material Durability
Zdroj:	Transactions of The Japan Institute of Electronics Packaging. 2:62-68
ISSN:	1884-8028 1883-3365
DOI:	10.5104/jiepeng.2.62
Popis:	In this study, 60 solder compositions were examined in an effort to improve the integrity against impact loads of the solder joints on an electroless Ni–P/Au surface finish. The Ag, Cu, and Ni contents in the Sn-based solder varied from 0 to 4.5 wt%, 0 to 2.0 wt%, and 0 to 0.05 wt%, respectively. Impact shear tests were performed to investigate solder joint integrity after solder ball reflowing, after reflow soldering twice more, after storage at room temperature for 168 hours, and after storage at 150°C for 1,000 hours. According to the results, the Ag content should be as low as possible, the Cu content should be from 0.5 to 0.7 wt%, and the Ni content should be as high as possible. The Ag and Ni contents should be determined in consideration of the wettability and the board-level reliability of the solder joints.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ea8f50cb3b1f792fb89a81d5e2d9f2eb https://doi.org/10.5104/jiepeng.2.62 Zobrazit plný text záznamu