Robust thermal control for CMOS-based lab-on-chip systems
| Autor: | Gordon H. Hall, Duncan G. Elliott, David L. Sloan, D. Moira Glerum, Saul Caverhill-Godkewitsch, Tianchi Ma, Matthew Reynolds, Jose Martinez-Quijada, Christopher J. Backhouse, Dan Sameoto |
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| Rok vydání: | 2015 |
| Předmět: |
Materials science
Temperature control business.industry Passive cooling Mechanical Engineering Microfluidics Electrical engineering High voltage Hardware_PERFORMANCEANDRELIABILITY Substrate (electronics) Lab-on-a-chip Electronic Optical and Magnetic Materials law.invention CMOS Mechanics of Materials law Hardware_INTEGRATEDCIRCUITS Electronic engineering Electronics Electrical and Electronic Engineering business |
| Zdroj: | Journal of Micromechanics and Microengineering. 25:075005 |
| ISSN: | 1361-6439 0960-1317 |
| DOI: | 10.1088/0960-1317/25/7/075005 |
| Popis: | The need for precise temperature control at small scales has provided a formidable challenge to the lab-on-chip community. It requires, at once, good thermal conductivity for high speed operation, good thermal isolation for low power consumption and the ability to have small (mm-scale) thermally independent regions on the same substrate. Most importantly, and, in addition to these conflicting requirements, there is a need to accurately measure the temperature of the active region without the need for device-to-device calibrations. We have developed and tested a design that enables thermal control of lab-on-chip devices atop silicon substrates in a way that could be integrated with the standard methods of mass-manufacture used in the electronics industry (i.e. CMOS). This is a significant step towards a single-chip lab-on-chip solution, one in which the microfluidics, high voltage electronics, optoelectronics, instrumentation electronics, and the world-chip interface are all integrated on a single substrate with multiple, independent, thermally-controlled regions based on active heating and passive cooling. |
| Databáze: | OpenAIRE |
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