Silicon-hydrogen (Si-H) bond activation on copper: reaction of silane on Cu(111)
Autor: | Ralph G. Nuzzo, Shrikant P. Lohokare, Benjamin C. Wiegand |
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Rok vydání: | 1993 |
Předmět: | |
Zdroj: | The Journal of Physical Chemistry. 97:11553-11562 |
ISSN: | 1541-5740 0022-3654 |
DOI: | 10.1021/j100146a033 |
Popis: | The activation and decomposition of silane on Cu(111) have been studied using Fourier transform infrared (FTIR), Auger electron (AES), and temperature-programmed reaction (TPRS) spectroscopies, as well as low-energy electron diffraction (LEED). Silane dissociatively chemisorbs on Cu(111) at 90 K. Cleavage of the Si-H bond yields two structurally distinct adsorbed silyl fragments. Infrared spectroscopy identifies the predominant intermediates formed under these conditions as being adsorbed SiH[sub 2] and SiH species. The relative and absolute concentrations of these intermediates depend sensitively on the surface coverage of both Si and H, which themselves depend upon the silane exposure. SiH[sub 2] is stable over a wide range of coverage up to 180 K, where it then undergoes Si-H bond cleavage to form surface bound SiH. At higher temperatures, bond scission in the Si-H moiety results in the formation of adsorbed silicon atoms and the desorption of dihydrogen in a peak centered at [approximately]330 K. Auger electron spectra show that the amount of silicon deposited on the Cu(111) surface in this way is approximately one-third of the amount deposited on a stable Cu[sub 3]Si surface. This latter surface is readily formed by carrying out the silane exposure at temperatures above 300 K. 39 refs., 15more » figs., 1 tab.« less |
Databáze: | OpenAIRE |
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