Electroplated compliant metal microactuators with small feature sizes using a removable SU-8 mould
| Autor: | S. Bouwstra, R. K. Vestergaard |
|---|---|
| Rok vydání: | 2000 |
| Předmět: |
Materials science
Plasma etching Fabrication Precision engineering Nanotechnology Photoresist Condensed Matter Physics medicine.disease_cause Electronic Optical and Magnetic Materials Hardware and Architecture Mold Plating Miniaturization medicine Electrical and Electronic Engineering Composite material Electroplating |
| Zdroj: | Microsystem Technologies. 6:214-217 |
| ISSN: | 1432-1858 0946-7076 |
| DOI: | 10.1007/s005420000059 |
| Popis: | In the work presented in this article a fabrication process for high aspect ratio metal microstructures has been developed using photoresist EPON SU-8. A smallest feature size of 2 μm with near vertical sidewalls has been achieved on a routine basis. The SU-8 photoresist has been used as mould for electroplating high aspect ratio metal micro actuators. A removal process has also been developed. The removal of the SU-8 mould after plating is done in a plasma asher using an oxygen or oxygen/fluorine plasma with plasma power as low as 200 W. To demonstrate the fabrication process a 10 μm thick nickel, electro-thermal micro actuator has been fabricated. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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