Optimization of Epoxy Molding Compound for Cu wire HTRB Robustness

Autor:	April Joy Garete, Zhiwen Li, Billie Xianghong Bi, Hans-Juergen Funke, Kwong Cheung Lee, Haibin Chen
Rok vydání:	2021
Zdroj:	2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
DOI:	10.1109/impact53160.2021.9696468
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e9f7b8247fc47fe5a8fb78b89ad3586c https://doi.org/10.1109/impact53160.2021.9696468 Zobrazit plný text záznamu