| Autor: |
Shoufeng Hu |
| Rok vydání: |
1996 |
| Předmět: |
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| Zdroj: |
Composites Science and Technology. 56:667-676 |
| ISSN: |
0266-3538 |
| DOI: |
10.1016/0266-3538(96)00051-6 |
| Popis: |
In this work we investigate the fiber/matrix interfacial debond of a single-fiber metal-matrix composite under transverse tensile loading at room temperature. Attention is focused on the interfacial debond initiation and propagation which is reportedly the primary cause for the low tensile strength of the composite in the transverse direction. The ultrasonic imaging technique is used as an experimental tool for investigating the interfacial debond. By using the proposed model of relative signal intensity, we are able to transform the experimental ultrasonic signal intensity data into data for the progressive interfacial debond under the increased applied stress. A finite element analysis has been performed for idealized interfacial conditions. The correlation between the experimental and finite element results reveals some important mechanisms of interfacial debond initiation and propagation. After initiation, the interfacial debond propagation is dominated by interfacial shear stress. This interfacial shear damage or Mode II fracture is the primary cause of interfacial failure and is detected by the ultrasonic non-destructive method. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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