| Autor: |
Ricky Anthony, Paul McCloskey, Elias Laforge, Cian O'Mathuna |
| Rok vydání: |
2016 |
| Předmět: |
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| Zdroj: |
32nd European Mask and Lithography Conference. |
| ISSN: |
0277-786X |
| DOI: |
10.1117/12.2247899 |
| Popis: |
In recent years, increased demand for high aspect ratio MEMS structures has driven the need for thick photoresist fabrication processes. In this work, the optimization of a thick photoresist process using a negative tone resist (THB-151N) is described. A thickness of 85 μm is obtained with an aspect ratio of 17:1 in a single coating process, with a 5 μm pitch. Conventional UV lithography is used and its parameters are optimized in order to achieve straight and near vertical sidewall profiles. The developed patterns are used as a mold to electroplate high aspect ratio copper windings of micro-inductors and micro-transformers. A high aspect ratio yields a copper track with a large cross sectional area resulting in a lower DC resistance. This enables a further reduction in the footprint area allowing for a more efficient manufacturing process and smaller device size. Unlike other high aspect ratio resist such as SU-8, this resist does not need a post exposure bake and can be readily removed after metal electroplating. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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