Autor:	Reinhold Bayerer, Josef Lutz, M. Feller, Thomas Dr. Licht, T. Herrmann
Rok vydání:	2007
Předmět:	Limiting factor Reliability (semiconductor) Materials science Power module Soldering Power cycling Electronic engineering Failure causes Temperature cycling Integrated circuit packaging Composite material
Zdroj:	2007 European Conference on Power Electronics and Applications.
DOI:	10.1109/epe.2007.4417702
Popis:	Improvements of power module technologies are investigated in different life time tests. Failure causes like solder fatigue become more important and a limiting factor for lifetime in power cycling tests. Different failure modes of solder joints in relation to power cycling conditions are shown.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e9b080361b61722e9024e26d82aa8ed7 https://doi.org/10.1109/epe.2007.4417702 Zobrazit plný text záznamu